People

Vesa Vuorinen

Principal University Lecturer

T410 Dept. Electrical Engineering and Automation

Full researcher profile

https://research.aalto.fi/...

[email protected]

Phone number

+358505922899

Research groups

Electronics Integration and Reliability, Senior University Lecturer

Publications

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel 2024 IEEE Transactions on Components, Packaging and Manufacturing Technology

Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Materials Characterization

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel 2024 Microelectronic Engineering

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel 2024 IEEE Transactions on Power Electronics

Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study

Vesa Vuorinen, Reijo Kouhia, Mauno Könönen, Jorma K. Kivilahti 2024 Journal of Biomedical Materials Research - Part B Applied Biomaterials

Co, In, and Co–In alloyed Cu₆Sn₅ interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices

Joint International Master in Smart Systems Integrated Solutions

Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen 2022 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings

Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding

F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel 2022 Journal of Alloys and Compounds