Glenn Ross
Academy Research Fellow
Academy Research Fellow
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
E-post
[email protected]
Utmärkelser
Vuoden sytyttäjä - Motivator of the year 2017 - 2018
For excellent and dedicated guidance in advising students' project work.
Award or honor granted for academic or artistic career
Department of Electrical Engineering and Automation
Apr 2018
Top 3 Student Session Winners
Impurities in electroplated Cu and void formation in Cu-Sn micro-connects
Award or honor granted for a specific work
Department of Electrical Engineering and Automation
Jan 2017
Forskningsgrupp
- Electronics Integration and Reliability, Academy Research Fellow
Publikationer
Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication
Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces
Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel
2024
In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS
Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel
2023
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel
2023
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope
Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2023
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS
Gabrelian Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel
2022