People

Glenn Ross

Academy Research Fellow

T410 Dept. Electrical Engineering and Automation

Full researcher profile

https://research.aalto.fi/...

[email protected]

Honors and awards

Vuoden sytyttäjä - Motivator of the year 2017 - 2018

For excellent and dedicated guidance in advising students' project work.

Award or honor granted for academic or artistic career Department of Electrical Engineering and Automation Apr 2018

Top 3 Student Session Winners

Impurities in electroplated Cu and void formation in Cu-Sn micro-connects

Award or honor granted for a specific work Department of Electrical Engineering and Automation Jan 2017

Research groups

Electronics Integration and Reliability, Academy Research Fellow

Publications

Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication

Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Advanced Electronic Materials

Scaling of piezoelectric in-plane NEMS : Towards nanoscale integration of AlN-based transducer on vertical sidewalls

Artem Gabrelian, Ville Miikkulainen, Glenn Ross, Mervi Paulasto-Kröckel 2024 Materials and Design

Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel 2024 Materials Characterization

Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces

Tarmo Nieminen, Tomi Koskinen, Vladimir Kornienko, Glenn Ross, Mervi Paulasto-Kröckel 2024 ACS Applied Electronic Materials

Electromigration Reliability of Cu₃Sn Microbumps for 3D Heterogeneous Integration

Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel 2024 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings

In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS

Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Glenn Ross, Mervi Paulasto-Kröckel 2023 Advanced Electronic Materials

Co, In, and Co–In alloyed Cu₆Sn₅ interconnects: Microstructural and mechanical characteristics

F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel 2023 Materials Science and Engineering: A

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel 2023 Scripta Materialia

Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope

Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel 2023 Micromachines

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel 2023 IEEE Transactions on Electron Devices