Nikhilendu Tiwary
Staff Scientist
Staff Scientist
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Sähköposti
[email protected]
Puhelinnumero
+358466138390
Osaamisalueet
Advanced packaging & reliability, 3D heterogeneous integration, MEMS/NEMS, III/V piezoelectric devices, Semiconductor physics
Tutkimusryhmät
- Electronics Integration and Reliability, Staff Scientist
Julkaisut
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel
2024
IEEE Transactions on Power Electronics
Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel
2024
2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope
Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2023
Micromachines
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
IEEE Transactions on Electron Devices
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings
Finite element simulation of solid-liquid interdiffusion bonding process
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Low-temperature Metal Bonding for Optical Device Packaging
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2021
Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds
Phillip Papatzacos, Nikhilendu Tiwary, Nils Hoivik, Hoang-Vu Nguyen, Avisek Roy, Knut E. Aasmundtveit
2021
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)