Vesa Vuorinen
Principal University Lecturer
Principal University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Sähköposti
[email protected]
Puhelinnumero
+358505922899
Tutkimusryhmät
- Electronics Integration and Reliability, Senior University Lecturer
Julkaisut
Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability
Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel
2024
IEEE Transactions on Components, Packaging and Manufacturing Technology
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Materials Characterization
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel
2024
Microelectronic Engineering
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel
2024
IEEE Transactions on Power Electronics
Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel
2024
2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings
Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study
Vesa Vuorinen, Reijo Kouhia, Mauno Könönen, Jorma K. Kivilahti
2024
Journal of Biomedical Materials Research - Part B Applied Biomaterials
Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
T. Wernicke, B. Rebhan, V. Vuorinen, M. Paulasto-Kröckel, V. Dubey, K. Diex, D. Wünsch, M. Baum, M. Wiemer, S. Tanaka, J. Froemel, K. E. Aasmundtveit, H. V. Nguyen, V. Dragoi
2024
ECS Journal of Solid State Science and Technology
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel
2023
Materials Science and Engineering: A
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
IEEE Transactions on Electron Devices