Vesa Vuorinen
Principal University Lecturer
Principal University Lecturer
T410 Dept. Electrical Engineering and Automation
Full researcher profile
https://research.aalto.fi/...
Email
[email protected]
Phone number
+358505922899
Research groups
- Electronics Integration and Reliability, Senior University Lecturer
Publications
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
Obert Golim, Vesa Vuorinen, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel
2024
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel
2024
Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study
Vesa Vuorinen, Reijo Kouhia, Mauno Könönen, Jorma K. Kivilahti
2024
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
F. Emadi, V. Vuorinen, G. Ross, M. Paulasto-Kröckel
2023
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
Joint International Master in Smart Systems Integrated Solutions
Knut E. Aasmundtveit, Changhai Wang, Márta Rencz, Mervi Paulasto-Kröckel, Kristin Imenes, Marc P.Y. Desmulliez, Ferenc Ender, Vesa Vuorinen
2022
2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding
F. Emadi, V. Vuorinen, H. Dong, G. Ross, M. Paulasto-Kröckel
2022
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
F. Emadi, V. Vuorinen, S. Mertin, Kim Widell, M. Paulasto-Kröckel
2022